1. When is the scholarship application submission deadline? The scholarship application submission duration is from 11 August 2008 to 30 September 2008. 2. What is the scholarship value? Successful recipients will each receive a scholarship package worth RM25,000. 3. How will the scholarship be disbursed? The scholarships shall be disbursed on a lump sump basis and shall be paid directly to the recipients. 4. Is this a bonded scholarship? No. This is a non-bonded scholarship. 5. Can I apply if I am a part-time student? Yes. This scholarship program is opened to all students who fulfill the eligibility criteria.   » NEXT PAGE

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